Wetting Behavior of Ternary Au-Ge-X (X=Sb, Sn) Alloys on Cu and Ni

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X=Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in contact with Cu and Ni substrates has been investigated. Au-13.7Ge-15.3Sn alloy showed complete wetting on both Cu and Ni substrates. Total spreading of Au-15Ge-17Sb alloy on Cu was also observed, while the final contact angle of this alloy on Ni was about 29°. Pronounced dissolution of Cu substrates into the solder alloys investigated was detected, while the formation of Ni-Ge intermetallic compounds at the interface of both solder/Ni systems suppressed the dissolution of Ni into the solde

4D printing of recoverable buckling-induced architected iron-based shape memory alloys

Architected materials exhibit extraordinary properties in comparison with conventional materials and structures, resulting in additional functionality and efficiency by engineering the geometry in harmony with the base material. Buckling-induced architected materials (BIAMs) are a class of architected materials that exhibit a significant potential to absorb and dissipate energy owing to their local instabilities. Previous studies have shown a trade-off between energy dissipation and geometrical recoverability in metallic BIAM, which limits their use in applications that require both of these features. This study, for the first time, presents 4D printing of buckling-induced architected iron-based shape memory alloys (BIA Fe-SMAs) using laser powder bed fusion (LPBF). The results show that 4D printing of BIA Fe-SMAs can offer both energy dissipation and geometrical recoverability (i.e., recentring). The study was conducted on two different alloy compositions of Fe-17Mn-5Si-10Cr-4Ni. Quasi-static cyclic tests were performed on the two BIA Fe-SMAs, and the samples were subsequently heated to 200 °C to activate the shape memory effect (SME) of the base material. The samples could recover the residual deformations accumulated during the cyclic load owing to the SME of the base material, which led to shape-recovery ratios of 96.8 and 98.7% for the studied BIA Fe-SMAs. The results of this study demonstrate that 4D printing of BIA Fe-SMAs can yield an enhanced multi-functional behavior by combining the material's inherent functional behavior with the functionalities of the architected structure. Notably, BIA Fe-SMA samples could reconfigure their initial shape without damage after densification, which sets them apart from conventional crushable lattices

Assessment of the Atomic Mobilities in fcc Cu-Fe and Cu-Ti Alloys

The experimentally measured diffusion coefficients of fcc Cu-Fe and Cu-Ti alloys in the published literature were reviewed critically in the present work. On the basis of the available thermodynamic information, the atomic mobilities of Cu, Fe, and Ti in fcc Cu-Fe and Cu-Ti alloys as a function of temperature and composition were assessed in terms of the CALPHAD method using the DICTRA® software. The optimized mobility parameters are presented. The calculated diffusion coefficients show an excellent agreement with the experimental data. The composition-distance profiles of the Cu-Ti binary diffusion couples reported in the literature were also predicted using the assessed mobility parameters. Overall good agreement is achieved between the experimental results and simulation

Diffusion and Atomic Mobilities in fcc Ni-Sn Alloys

The composition-distance profiles in face-centered cubic (fcc) Ni-Sn alloys at 1173, 1223, 1273, and 1323K were measured by means of electronic probe microanalysis (EPMA) using Ni/Ni-7.3at.%Sn diffusion couples. Based on the available thermodynamic information and various experimental diffusion coefficients, the atomic mobilities of Ni and Sn in fcc Ni-Sn alloys were assessed as a function of temperature and composition in terms of the CALPHAD method using the DICTRA® software package. Optimized mobility parameters are presented. Comparisons between the calculated and measured diffusion coefficients show that most of the experimental information can be reproduced reasonably. The obtained mobility parameters can also predict satisfactorily the composition-distance profiles of the Ni/Ni-7.3at.%Sn diffusion couples determined in the present wor

Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30MPa to 35MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zon

Thermodynamic assessment of the Cu-Ge binary system

The Cu-Ge binary system was assessed thermodynamically using the CALPHAD method through Thermocalc (R) software package based on the evaluation of all available experimental data from the published literature. The solution phases, including liquid, fcc, hcp and diamond (Ge), were described by the substitutional solution model, of which the excess Gibbs energies were expressed with the Redlich-Kister polynomial. Due to their narrow homogeneity ranges, all intermetallic compounds, epsilon-Cu0.765Ge0.235, theta-Cu0.735Ge0.265 and eta-Cu0.75Ge0.25, were modeled as stoichiometric compounds. A set of self-consistent thermodynamic parameters formulating the Gibbs energies of various phases in the Cu-Ge binary system was obtained finally. A good agreement is achieved between the calculated results and the reported experimental data. (C) 2010 Elsevier B.V. All rights reserved

Microstructure and oxide particle stability in a novel ODS γ-TiAl alloy processed by spark plasma sintering and laser additive manufacturing

In this work, a novel oxide dispersion strengthened titanium aluminide alloy (Ti-45Al-3Nb-<0.2Y2O3 at.%) was developed for powder-based processing technologies with a focus on spark plasma sintering and additive manufacturing. Titanium aluminides are promising structural intermetallics for weight reduction and an increased performance of high temperature components. The alloy design and selection process was supported by computational thermodynamics based on the CALPHAD approach, taking into account requirements for processing as well as long term alloy behavior under service conditions. Processing trials using spark plasma sintering, direct metal deposition and selective laser melting were conducted to study the alloy behavior, microstructure formation and introduction as well as stability of the ODS particles. Additionally, thermal annealing on the sintered and laser consolidated material was performed. Conventional dual phase α2-Ti3Al and γ-TiAl duplex and near-lamellar microstructures were obtained from the processed material. The ODS particles were homogeneously distributed in the alloy matrix after processing in the liquid state. For the direct metal deposition process, the novel alloy was compared to the established GE48-2-2 alloy (Ti-48Al-2Cr-2Nb) in terms of phases, microstructure and texture after processing. A significantly reduced texture formation was observed with the novel alloy. The hardness of the consolidated material shows superior properties for ODS-containing TiAl compared to ODS-free material. This work provides a first step towards tailored alloys for AM and the production of ODS TiAl alloys

Proving Memory Safety of the ANI Windows Image Parser Using Compositional Exhaustive Testing

We report in this paper how we proved memory safety of a complex Windows image parser written in low-level C in only three months of work and using only three core tech-niques, namely (1) symbolic execution at the x86 binary level, (2) exhaustive program path enumeration and testing, and (3) user-guided program decomposition and summariza-tion. We also used a new tool, named MicroX, for executing code fragments in isolation using a custom virtual machine designed for testing purposes. As a result of this work, we are able to prove, for the first time, that a Windows image parser is memory safe, i.e., free of any buffer-overflow secu-rity vulnerabilities, modulo the soundness of our tools and several additional assumptions regarding bounding input-dependent loops, fixing a few buffer-overflow bugs, and ex-cluding some code parts that are not memory safe by design. In the process, we also discovered and fixed several limita-tions in our tools, and narrowed the gap between systematic testing and verification. 1